CC2651R3SIPA

ACTIVE

Product details

Protocols Bluetooth low energy, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Type Wireless module Features Bluetooth LE support, Bluetooth mesh, LE 1M PHY, LE 2M PHY, OAD, Sleepy end device, Zigbee coordinator, Zigbee network processor Peripherals 1 SPI, 1 UART, 12-bit ADC 8-channel, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S Rating Catalog Flash memory (kByte) 352 RAM (kByte) 32 Number of GPIOs 32 Security Crypto acceleration (RNG, AES, SHA, ECC), Debug security, Device identity, Secure boot, Secure firmware update Sensitivity (best) (dBm) -104 Operating temperature range (°C) -40 to 105
Protocols Bluetooth low energy, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Type Wireless module Features Bluetooth LE support, Bluetooth mesh, LE 1M PHY, LE 2M PHY, OAD, Sleepy end device, Zigbee coordinator, Zigbee network processor Peripherals 1 SPI, 1 UART, 12-bit ADC 8-channel, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S Rating Catalog Flash memory (kByte) 352 RAM (kByte) 32 Number of GPIOs 32 Security Crypto acceleration (RNG, AES, SHA, ECC), Debug security, Device identity, Secure boot, Secure firmware update Sensitivity (best) (dBm) -104 Operating temperature range (°C) -40 to 105
QFM (MOU) 50 49 mm² 7 x 7

Wireless microcontroller

  • Powerful 48-MHz Arm® Cortex®-M4 processor
  • 352KB flash program memory
  • 32KB of ultra-low leakage SRAM
  • 8KB of Cache SRAM (Alternatively available as general-purpose RAM)
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.2 Low Energy, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Low power consumption

  • MCU consumption:
    • 3.60 mA active mode, CoreMark
    • 61 µA/MHz running CoreMark
    • 0.8 µA standby mode, RTC, 32KB RAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Radio Consumption:
    • 6.8 mA RX
    • 7.1 mA TX at 0 dBm
    • 9.6 mA TX at +5 dBm

Wireless protocol support

High performance radio

  • -104 dBm for Bluetooth® Low Energy 125-kbps
  • Output power up to +5 dBm with temperature compensation

Regulatory compliance

  • Regulatory certification for compliance with worldwide radio frequency:
    • ETSI RED (Europe) / RER (UK)
    • ISED (Canada)
    • FCC (USA)

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • UART, SSI, I 2C, I 2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128-bit cryptographic accelerator
  • True random number generator (TRNG)
  • Additional cryptography drivers available in Software Development Kit (SDK)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • T j: -40 to +105°C

Package

  • 7-mm × 7-mm MOU (32 GPIOs)
  • RoHS-compliant package

Wireless microcontroller

  • Powerful 48-MHz Arm® Cortex®-M4 processor
  • 352KB flash program memory
  • 32KB of ultra-low leakage SRAM
  • 8KB of Cache SRAM (Alternatively available as general-purpose RAM)
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.2 Low Energy, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Low power consumption

  • MCU consumption:
    • 3.60 mA active mode, CoreMark
    • 61 µA/MHz running CoreMark
    • 0.8 µA standby mode, RTC, 32KB RAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Radio Consumption:
    • 6.8 mA RX
    • 7.1 mA TX at 0 dBm
    • 9.6 mA TX at +5 dBm

Wireless protocol support

High performance radio

  • -104 dBm for Bluetooth® Low Energy 125-kbps
  • Output power up to +5 dBm with temperature compensation

Regulatory compliance

  • Regulatory certification for compliance with worldwide radio frequency:
    • ETSI RED (Europe) / RER (UK)
    • ISED (Canada)
    • FCC (USA)

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • UART, SSI, I 2C, I 2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128-bit cryptographic accelerator
  • True random number generator (TRNG)
  • Additional cryptography drivers available in Software Development Kit (SDK)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • T j: -40 to +105°C

Package

  • 7-mm × 7-mm MOU (32 GPIOs)
  • RoHS-compliant package

The SimpleLink™ CC2651R3SIPA device is a multiprotocol 2.4-GHz wireless microcontroller (MCU) supporting Zigbee®, Bluetooth® 5.2 Low Energy, IEEE 802.15.4g, TI 15.4-Stack (2.4 GHz). The CC2651R3SIPA is based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The CC2651R3SIPA is an ultra-compact 7-mm x 7-mm certified wireless module 2.4 GHz with integrated antenna, DCDC components, Balun, and high frequency crystal oscillator.

The CC2651R3SIPA has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in the 2360 to 2500-MHz frequency band. The CC2651R3SIPA supports +5 dBm TX at 9.6 mA in the 2.4-GHz band. CC2651R3SIPA has a receive sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY.

The CC2651R3SIPA has a low sleep current of 0.9 µA with RTC and 32KB RAM retention.

TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC2651R3SIPA device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host MCU. CC2651R3SIPA is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

The SimpleLink™ CC2651R3SIPA device is a multiprotocol 2.4-GHz wireless microcontroller (MCU) supporting Zigbee®, Bluetooth® 5.2 Low Energy, IEEE 802.15.4g, TI 15.4-Stack (2.4 GHz). The CC2651R3SIPA is based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The CC2651R3SIPA is an ultra-compact 7-mm x 7-mm certified wireless module 2.4 GHz with integrated antenna, DCDC components, Balun, and high frequency crystal oscillator.

The CC2651R3SIPA has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in the 2360 to 2500-MHz frequency band. The CC2651R3SIPA supports +5 dBm TX at 9.6 mA in the 2.4-GHz band. CC2651R3SIPA has a receive sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY.

The CC2651R3SIPA has a low sleep current of 0.9 µA with RTC and 32KB RAM retention.

TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC2651R3SIPA device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host MCU. CC2651R3SIPA is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

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Technical documentation

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* Data sheet CC2651R3SIPA SimpleLink™ Multiprotocol 2.4 GHz Wireless System-in-Package Module with integrated Antenna & 352-KB Memory datasheet (Rev. B) PDF | HTML 17 Aug 2023
* Errata CC2651R3SIPA Errata (Rev. A) PDF | HTML 29 Jun 2022
* User guide CC13x1x3, CC26x1x3 SimpleLink™ Wireless MCU Technical Reference Manual PDF | HTML 11 May 2022
Cybersecurity advisory Bluetooth SIG Erratum - Incoming Notification/Indication Tests Upon Reconnection PDF | HTML 28 Aug 2023
Application note CC2651R3SIPA OEM Integrators Guide PDF | HTML 19 Aug 2022
Certificate CC2651R3SIPA UK Doc (Certification) 24 Jun 2022
Certificate CC2651R3SIPA CE DoC (Certification) 25 Feb 2022
Application note Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 25 Feb 2022
Application note RF PCB Simulation Cookbook 09 Jan 2019

Design & development

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Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

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