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TDA3MA

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Low power SoC w/ full-featured processing & vision acceleration for ADAS applications

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Data sheet
Errata

TDA3MA

ACTIVE
Data sheet Order now

Product details

DSP type 2 C66x DSP (max) (MHz) 500, 745 Operating system Android, Linux, RTOS Security Debug security, Device identity, Isolation firewalls, Secure boot & storage & programming, Software IP protection Ethernet MAC 2-Port 1Gb switch TI functional safety category Functional Safety-Compliant Power supply solution LP87322E-Q1, LP87322F-Q1, LP87332A-Q1, TPS65917-Q1, TPS65919-Q1 Rating Automotive Operating temperature range (°C) -40 to 125
DSP type 2 C66x DSP (max) (MHz) 500, 745 Operating system Android, Linux, RTOS Security Debug security, Device identity, Isolation firewalls, Secure boot & storage & programming, Software IP protection Ethernet MAC 2-Port 1Gb switch TI functional safety category Functional Safety-Compliant Power supply solution LP87322E-Q1, LP87322F-Q1, LP87332A-Q1, TPS65917-Q1, TPS65919-Q1 Rating Automotive Operating temperature range (°C) -40 to 125
FCBGA (ABF) 367 225 mm² 15 x 15
  • Architecture designed for ADAS applications
  • Video and image processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Video input and video output
  • Up to 2 C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512kB of on-chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) interconnects
  • Memory Interface (EMIF) module
    • Supports DDR3/DDR3L up to DDR-1066
    • Supports DDR2 up to DDR-800
    • Supports LPDDR2 up to DDR-667
    • Up to 2GB supported
  • Dual Arm® Cortex®-M4 Image Processor Unit (IPU)
  • Vision accelerationPac
    • Embedded Vision Engine (EVE)
  • Display subsystem
    • Display controller with DMA engine
    • CVIDEO / SD-DAC TV analog composite output
  • Video Input Port (VIP) module
    • Support for up to 4 multiplexed input ports
  • On-chip temperature sensor that is capable of generating temperature alerts
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 3-port (2 external) Gigabit Ethernet (GMAC) switch
  • Controller Area Network (DCAN) module
    • CAN 2.0B protocol
  • Modular Controller Area Network (MCAN) module
    • CAN 2.0B protocol
  • Eight 32-bit general-purpose timers
  • Three configurable UART modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI interface
  • Two Inter-Integrated Circuit (I2C™) ports
  • Three Multichannel Audio Serial Port (McASP) modules
  • Secure Digital Input Output Interface (SDIO)
  • Up to 126 General-Purpose I/O (GPIO) pins
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • Automotive AEC-Q100 qualified
  • 15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)
  • Seven Dual Clock Comparators (DCC)
  • Memory Cyclic Redundancy Check (CRC)
  • TESOC (LBIST/PBIST) that enables field testing of logic and on-chip memory
  • Error Signaling Module (ESM)
  • Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers
  • 8-channel 10-bit ADC
  • MIPI® Camera Serial Interface 2 (CSI-2)
  • PWMSS
  • Full HW image pipe: DPC, CFA, 3D-NF, RGB-YUV
    • WDR, HW LDC and perspective
  • Architecture designed for ADAS applications
  • Video and image processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Video input and video output
  • Up to 2 C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512kB of on-chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) interconnects
  • Memory Interface (EMIF) module
    • Supports DDR3/DDR3L up to DDR-1066
    • Supports DDR2 up to DDR-800
    • Supports LPDDR2 up to DDR-667
    • Up to 2GB supported
  • Dual Arm® Cortex®-M4 Image Processor Unit (IPU)
  • Vision accelerationPac
    • Embedded Vision Engine (EVE)
  • Display subsystem
    • Display controller with DMA engine
    • CVIDEO / SD-DAC TV analog composite output
  • Video Input Port (VIP) module
    • Support for up to 4 multiplexed input ports
  • On-chip temperature sensor that is capable of generating temperature alerts
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 3-port (2 external) Gigabit Ethernet (GMAC) switch
  • Controller Area Network (DCAN) module
    • CAN 2.0B protocol
  • Modular Controller Area Network (MCAN) module
    • CAN 2.0B protocol
  • Eight 32-bit general-purpose timers
  • Three configurable UART modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI interface
  • Two Inter-Integrated Circuit (I2C™) ports
  • Three Multichannel Audio Serial Port (McASP) modules
  • Secure Digital Input Output Interface (SDIO)
  • Up to 126 General-Purpose I/O (GPIO) pins
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • Automotive AEC-Q100 qualified
  • 15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)
  • Seven Dual Clock Comparators (DCC)
  • Memory Cyclic Redundancy Check (CRC)
  • TESOC (LBIST/PBIST) that enables field testing of logic and on-chip memory
  • Error Signaling Module (ESM)
  • Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers
  • 8-channel 10-bit ADC
  • MIPI® Camera Serial Interface 2 (CSI-2)
  • PWMSS
  • Full HW image pipe: DPC, CFA, 3D-NF, RGB-YUV
    • WDR, HW LDC and perspective

TI’s TDA3x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA3x family enables broad ADAS applications in automobiles by integrating an optimal mix of performance, low power, smaller form factor and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling the industry’s broadest range of ADAS applications including front camera, rear camera, surround view, radar, and fusion on a single architecture.

The TDA3x SoC incorporates a heterogeneous, scalable architecture that includes a mix of Texas Instruments (TI)’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power profile in different package options (including Package-On-Package) to enable small form factor designs. TDA3x SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based surround view systems, displays, CAN and GigB Ethernet AVB.

The Vision AccelerationPac for this family of products includes embedded vision engine (EVE) offloading the vision analytics functionality from the application processor while also reducing the power footprint. The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program execution and a vector coprocessor for specialized vision processing.

Additionally, TI provides a complete set of development tools for the Arm, DSP, and EVE coprocessor, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

The TDA3x ADAS processor is qualified according to AEC-Q100 standard.

TI’s TDA3x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA3x family enables broad ADAS applications in automobiles by integrating an optimal mix of performance, low power, smaller form factor and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling the industry’s broadest range of ADAS applications including front camera, rear camera, surround view, radar, and fusion on a single architecture.

The TDA3x SoC incorporates a heterogeneous, scalable architecture that includes a mix of Texas Instruments (TI)’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power profile in different package options (including Package-On-Package) to enable small form factor designs. TDA3x SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based surround view systems, displays, CAN and GigB Ethernet AVB.

The Vision AccelerationPac for this family of products includes embedded vision engine (EVE) offloading the vision analytics functionality from the application processor while also reducing the power footprint. The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program execution and a vector coprocessor for specialized vision processing.

Additionally, TI provides a complete set of development tools for the Arm, DSP, and EVE coprocessor, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

The TDA3x ADAS processor is qualified according to AEC-Q100 standard.
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More Information

This product family is available for high volume automotive manufacturers. Please contact your TI sales representative for more details.

Learn more about the TDAx SoC for advanced driver assistance systems (ADAS).

Technical documentation

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Type Title Date
* Data sheet TDA3x SoC for Advanced Driver Assistance Systems (ADAS) 15mm Package (ABF) Silicon Revision 2.0 datasheet (Rev. H) PDF | HTML 04 Feb 2020
* Errata TDA3x SoC for Advanced Driver Assistance Systems (ADAS) (SR 1.0, 1.0A) (Rev. F) 01 Oct 2019
User guide Single LP8733-Q1 User's Guide to Power DRA78x and TDA3 (Rev. A) PDF | HTML 31 Mar 2021
White paper Stereo vision- facing the challenges and seeing the opportunities for ADAS (Rev. A) 24 Jul 2020
Application note AM57x, DRA7x, and TDA2x EMIF Tools (Rev. E) 06 Jan 2020
User guide TDA3x Technical Reference Manual (Rev. D) 29 Jul 2019
Application note TDA2x/TDA2E Performance (Rev. A) PDF | HTML 10 Jun 2019
Application note TDA3xx Tester On Chip (TESOC) (Rev. A) 19 Oct 2018
Application note ECC/EDC on TDAxx (Rev. B) 13 Jun 2018
Application note TMS320C66x XMC Memory Protection 31 Jan 2018
Application note DSS Bit Exact Output (Rev. A) 12 Jan 2018
Application note Flashing Utility - mflash 09 Jan 2018
White paper Embedded low-power deep learning with TIDL 08 Dec 2017
Application note Dynamic Backup Lines PDF | HTML 14 Nov 2017
Application note Optimizing DRA7xx and TDA2xx Processors for use with Video Display SERDES (Rev. B) 07 Nov 2017
Application note A Guide to Debugging With CCS on the DRA75x, DRA74x, TDA2x and TDA3x Family of D (Rev. B) 03 Nov 2017
Application note DSS BT656 Workaround for TDA2x (Rev. A) 03 Nov 2017
Functional safety information Safety Features on VisionSDK 26 Oct 2017
Application note IISS Image Pipe for Alternate CFA Formats 16 Aug 2017
Functional safety information Safety Manual for TDA3x Automotive Vision Safety Critical Applications Processor 18 Jul 2017
Application note Quality of Service (QoS) Knobs for DRA74x, DRA75x & TDA2x Family of Devices (Rev. A) 15 Dec 2016
Application note Quad Channel Camera Application for Surround View and CMS Camera Systems (Rev. A) 23 Aug 2016
Application note ADC as Voltage Monitoring in TDA3x 20 Jun 2016
Application note TDA3xx ISS Tuning and Debug Infrastructure 02 Jun 2016
Application note ADAS Power Management 07 Mar 2016
White paper Multicore SoCs stay a step ahead of SoC FPGAs 23 Feb 2016
Application note TDA3x Error Signaling Module (ESM) 26 Jan 2016
White paper Surround view camera systems for ADAS (Rev. A) 20 Oct 2015
Application note Guide to fix Perf Issues Using QoS Knobs for DRA74x, DRA75x, TDA2x & TD3x Device 13 Aug 2014
White paper TI Vision SDK, Optimized Vision Libraries for ADAS Systems 14 Apr 2014
White paper TI Gives Sight to Vision-Enabled Automotive Technologies 16 Oct 2013
White paper Empowering Automotive Vision with TI’s Vision AccelerationPac 13 Oct 2013

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